Electronics and appliances
Electronics and electrical industry
We provide a series of products to the field of electronic and electrical products, including crystalline silicon powder , fused silicon powder , soft composite silicon powder , spherical silicon powder , and spherical alumina . At the same time, relying on our testing and application experiment center, Lianrui can provide customers with product improvement and combined use solutions according to individual needs.
> Epoxy plastic sealing material (EMC)
Electronic devices in electronic and electrical products are usually encapsulated with epoxy plastic encapsulant (EMC), and filler components such as silicon micropowder can make epoxy plastic encapsulants cost-effective. Lianrui's NOVOPOWDER crystalline silicon powder and fused silicon powder products can be used as excellent fillers for general purposes.
Spherical silicon powder is widely used in high-end semiconductor device packaging due to its characteristics of high filling, high flow, low wear and low stress. In particular, spherical silicon fine powder for precise control of coarse particles can also be used in epoxy gap molding materials for narrow-gap packaging, as well as fillers for liquid packaging resins such as underfillers, globe tops, and various resin substrates ( Substrate).
In addition, with the miniaturization of electronic products, the degree of integration is getting higher and higher, and the thermal management of electronic products is becoming more and more important. Round corner crystalline silicon powder and spherical alumina can provide excellent thermal conductivity for fully encapsulated and highly thermally conductive epoxy molding compounds.
The printed circuit boards in electronic and electrical products often use copper clad laminates (CCL) as the base material, and the addition of ultra-fine silicon powder as a filler can improve the CTE, heat resistance and reliability of copper clad laminates.
Lianrui's NOVOPOWDER ultrafine crystalline silicon powder and soft composite silicon powder are universal copper-clad plate fillers; molten silicon powder can be used as Low Dk copper-clad plate fillers;
Spherical silica powder can be used as a high filling filler to provide excellent performance for Low Dk copper-clad boards, IC substrates, etc .; spherical alumina products can be used as ideal fillers for high thermal conductivity copper-clad boards such as aluminum substrates.
> Printed circuit board ink
Printed circuit board ink is a necessary protective material for circuit boards. Lianrui's NOVOPOWDER ultrafine crystalline silicon powder can provide circuit boards with ideal scratch resistance, low thermal expansion coefficient, chemical resistance and long-term reliability.
> Electronic potting
Components such as power supplies in electronic and electrical products are often sealed with epoxy or silicone electronic potting compounds. Lianrui's NOVOPOWDER crystalline silicon powder , fused silicon powder , and spherical silicon powder can be selected as fillers for potting glue according to various considerations such as thermal expansion coefficient, thermal conductivity, viscosity, and cost. Spherical alumina is used for power device sealing due to its high filling and cost-effective thermal conductivity.
> Thermal Interface Materials (TIM)
The miniaturization of electronics makes thermal management necessary. Thermal interface materials (TIM) can fill air gaps caused by uneven contact surfaces of electronic product components, thereby improving heat dissipation. Thermal pads or thermal greases are common thermal interface materials, and highly thermally conductive fillers, such as crystalline silicon powder , spherical alumina powder , are important components of thermal pads or thermal greases.